Low-dielectric glass flakes/Low-dielectric milled fibers
Low-dielectric glass flakes and low-dielectric milled fibers not only improve the dimensional stability and mechanical properties of high-frequency-compatible molded resin products, they simultaneously reduce transmission loss.
Low-dielectric glass flakes are scale-like glass additives with thicknesses available at the submicron level. Low-dielectric milled fibers are fibrous glass additives with a length of approximately 100 µm. Both are high-performance glass additives with greatly reduced dielectric constant-dissipation factor compared to conventional glass additives. Low-dielectric glass flakes, in addition to improving the dimensional stability and mechanical properties of molded resin finished products, are capable of suppressing transmission loss. Low-dielectric milled fiber can be used as a replacement for common glass-composition milled fiber, thereby improving transmission loss while also maintaining the mechanical properties of resin-molded products.
Low-dielectric glass flakes
NSG provides the marketplace with two types of low-dielectric glass flakes: LLD glass flakes and SL glass flakes. By starting with a specially formulated glass composition, LLD glass flakes provide both a low dielectric constant and a low dissipation factor. Utilizing a proprietary NSG processing technology, SL glass flakes contain approximately 97% silica elements. Within the scale-shaped glass flake field, NSG has achieved the highest standard of dielectric characteristics with a remarkably low dielectric constant and low dissipation factor.
Low-dielectric milled fibers
Low-dielectric milled fibers are fibrous glass filler with a length of approximately 100 µm. These are based on LLD glass composition, which has a lower dielectric constant and dissipation factor than E-glass.
Low-dielectric glass flake lineup
Particle size: Samples with mean particle sizes of 10 and 160 µm for LLD glass flakes and 5 and 30 µm for SL glass flakes are available as standard material. Using NSG's proprietary milling technology, the samples are adjusted to have sharp particle size distribution that suppresses maximum particle diameter.
Surface treatment: Suitable surface treatments are available for resins and applications.
Lowering dielectric constant and lower dissipation factor in molded resin products
When low-dielectric glass flakes are mixed with PBT resin, the dielectric constant and dissipation factor of molded resin products can be lowered at the high frequency range of 20–40 GHz.
Dimensional stability and low coefficient of thermal expansion
LLD glass flakes and SL glass flakes are scale-shaped glass additives having a high aspect ratio (thickness-to-particle average diameter ratio) and submicron thickness. When compared to the chopped strands of fibrous anisotropic additives, thin glass flakes are especially and naturally effective in isotropic additive alignment used in the plastic compounds resulting in significantly reduced or eliminated warpage (differential shrinkage) of molded resin finished products. Additionally, NSG glass flakes are able to suppress the overall plastic part shrinkage rate. Because low-dielectric glass flakes have a very low coefficient of thermal expansion, glass flakes themselves can realize high dimensional stability in relation to temperature changes at the time of plastic component processing.
Applications of low-dielectric glass flakes
Widely applicable to molded resin products for high-frequency telecommunications
・Housings, radomes, connectors, antennas, etc., for products and components with high-frequency communications technology
・Rigid and flexible print circuit boards used for high-frequency components in base stations, smartphones, PCs and the like
Lowering dielectric constant and dissipation factor in molded resin products
When low dielectric-constant milled fibers are mixed with PBT resin, the dielectric constant and dissipation factor of molded products can be lowered at the high frequency range of 20–40 GHz.
Warpage and mold shrinkage rate of molded resin products
Low-dielectric milled fibers have similar to or greater dimensional stability than E-glass milled fibers.
Mechanical properties of molded resin products
Low-dielectric milled fibers have similar mechanical properties to E-glass milled fibers.
Applications of low-dielectric milled fibers
NSG low dielectric milled fiber additives are widely used in molded resin formulations where the finished products are component in high-frequency telecommunications infrastructure. The additives are particularly effective in reducing transmission loss for molded resin products in which E-glass milled fibers have been previously used. Housings, radomes, connectors, antennas, etc., for products and components that use high-frequency communications technology.
Rate of polarization of a dielectric in an electric field.
Numerical value expressing the degree of electrical energy loss within the dielectric.
Coefficient of thermal expansion (CTE)
Expansion rate of material against increasing temperature (expressed as ppm).
Glass with excellent electrical insulation properties that effectively does not contain alkaline elements.
Number obtained from dividing particle size by thickness of glass flake, indicating rate of particle size/thickness.
Fibrous glass filler with a length of 100-200 µm, made by milling long fibers of E-glass composition. The filler is used for resins to improve the mechanical strength of the molded resin products.
Is it possible to receive sample?
Yes. Please inquire for details.Contact us
Is surface treatment available?
Yes. Suitable treatment can be selected in accordance with the resin and use.
Is it possible to change the particle size?
Yes. Please inquire for details.Contact us
Is it possible to change the thickness?
Firstly, please consider standard thickness products (1 µm or less) that realize excellent dimensional stability and strength characteristics.
What is the price and delivery time?
Please inquire for details.Contact us
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