High-performance resin

With thinner and smaller mobile devices, electronic connectors also need to be thinner (1 mm or less). It was difficult to prevent such small resin parts from warping, but NSG's ultra-thin glass product, FINEFLAKE, can be used as an additive in engineered plastic parts, achieving superior dimensional stability.
NSG continues the materials development programs in order to support the expansion of wireless communications with novel innovations.

Because of its light weight and ease of forming, engineered thermoplastic molded products are widely used for automobiles. Especially in recent years, there are increasing applications for reduced weight of automobiles in order to improve fuel efficiency and reduce CO2 emissions.
For the engine compartment and for parts near the power module where heat-resistance is desired, high-performance thermoplastic molded products are being employed.
As a reinforcing additive with good balance between precision, strength, and heat resistance, more customers are using FLEKA^® to achieve the industry's new requirements.

FRP/FRTP is garnering attention in the market as a substitue for metal in order to reduce weight.
As a potential reinforcement material, carbon fiber and aramid fiber are being considered, but neither material satisfies all requirements : cost, appearance, electrical insulation, radio transmission, durability and mechanical strength.
NSG has developed a new reinforcing fiber, MAGNAVI^™ . It is a high-performance engineerd material having superior strength, elastic modulus, appearance, electrical insulation, and radio transmission characteristics, now commercialized for the marketplace. NSG is working to expanding its sales to support application of FRP/FRTP into the 5G wireless communications infrastructure.

As the next-generation mobile communication system, 5G/6G, expands, both capacity and speed for wireless communication increases further. The demand for flexible printed circuit board with low dielectric resin material is expanding to minimize loss in transmission.
However, some low dielectric resin has large thermal expansion, which makes difficult to apply to the Flexible Printed Circuit board.
NSG utilize both their own ultra-thin glass fiber and thin papermaking technology to develop Super Glass Paper: thin, flexible and heat durable ultra-thin glass nonwoven fabric.
By combining low dielectric resin material and Super Glass Paper, thermal expansion can be suppressed without losing properties of resin.
As a new material that supports needs for higher speed and capacity in information society, NSG Super Glass Paper is anticipated to play an active role in the field of communication devices.