Low-dielectric glass flakes
Low-dielectric glass flakes are scaly amorphous glass fillers that reduce transmission loss in high-frequency molded products using NSG's proprietary glass composition and processing technology.
Product summary
Low-dielectric glass flakes are high-performance glass fillers (amorphous) with significantly lower dielectric constant/dielectric tangent than conventional glass fillers.
It is effective in reducing transmission loss, improving coefficient of thermal expansion (CTE), and suppressing warpage and waviness, which are required for next-generation semiconductor materials and high-frequency compatible materials. It is expected to improve performance by reducing energy consumption in semiconductor components, increasing the number of layers in package substrates, increasing their size, and suppressing disconnections and cracks in copper wiring.
Low-dielectric glass flakes
NSG provides the marketplace with two types of low-dielectric glass flakes: LLD glass flakes and SL glass flakes. By starting with a specially formulated glass composition, LLD glass flakes provide both a low dielectric constant and a low dissipation factor. Utilizing a proprietary NSG processing technology, SL glass flakes contain approximately 97% silica elements. Within the scale-shaped glass flake field, NSG has achieved the highest standard of dielectric characteristics with a remarkably low dielectric constant and low dissipation factor.
Characteristics of low-dielectric glass flakes
LLD glass flake (mean thickness :0.7 µm, mean particle size :160 µm) SEM image
LLD glass flake (mean thickness :0.7 µm, mean particle size :160 µm)
SL glass flake (mean thickness :0.8 µm, mean particle size :30 µm) SEM image
SL glass flake (mean thickness :0.8 µm, mean particle size :30 µm)
Low-dielectric glass flake lineup
Particle size: Samples with mean particle sizes of 10 and 160 µm for LLD glass flakes and 5 and 30 µm for SL glass flakes are available as standard material. Using NSG's proprietary milling technology, the samples are adjusted to have sharp particle size distribution that suppresses maximum particle diameter.
Surface treatment: Suitable surface treatments are available for resins and applications.
Low-dielectric glass flake particle size
Low-dielectric glass flake particle size distribution
Lowering dielectric constant and lower dissipation factor in molded resin products
When low-dielectric glass flakes are mixed with PBT resin, the dielectric constant and dissipation factor of molded resin products can be lowered at the high frequency range of 20–40 GHz.
Dielectric constant of molded resin products with low-dielectric glass flake
Dissipation factor of molded resin products with low-dielectric glass flake
Dimensional stability and low coefficient of thermal expansion
LLD glass flakes and SL glass flakes are scale-shaped glass additives having a high aspect ratio (thickness-to-particle average diameter ratio) and submicron thickness. When compared to the chopped strands of fibrous anisotropic additives, thin glass flakes are especially and naturally effective in isotropic additive alignment used in the plastic compounds resulting in significantly reduced or eliminated warpage (differential shrinkage) of molded resin finished products. Additionally, NSG glass flakes are able to suppress the overall plastic part shrinkage rate. Because low-dielectric glass flakes have a very low coefficient of thermal expansion, glass flakes themselves can realize high dimensional stability in relation to temperature changes at the time of plastic component processing.
Warpage of molded products containing low-dielectric flakes and anisotropy at the time of mold shrinkage (TD/MD)
Comparison of warpage in molded resin products (0.5 mm thickness)
Rate of mold shrinkage of molded resin products containing low-dielectric glass flakes
Thermal expansion coefficient of molded resin products containing low-dielectric glass flakes
Applications of low-dielectric glass flakes
Widely applicable to molded resin products for high-frequency telecommunications
・Housings, radomes, connectors, antennas, etc., for products and components with high-frequency communications technology
・Rigid and flexible print circuit boards used for high-frequency components in base stations, smartphones, PCs and the like
Base station antenna (PCBs, antenna, radomes)
Smartphones (PCBs, connectors, housings)
Millimeter wave radar (PCBs, connectors, radomes)
Print circuit boards (copper clad laminates, solder resists, interlayer insulation)
Glossary
Dielectric constant(Dk)
Rate of polarization of a dielectric in an electric field.
Dissipation factor(Df)
Numerical value expressing the degree of electrical energy loss within the dielectric.
Coefficient of thermal expansion (CTE)
Expansion rate of material against increasing temperature (expressed as ppm).
E-glass
Glass with excellent electrical insulation properties that effectively does not contain alkaline elements.
Aspect ratio
Number obtained from dividing particle size by thickness of glass flake, indicating rate of particle size/thickness.
FAQ
Is it possible to receive sample?
Yes. Please inquire for details.
Contact usIs surface treatment available?
Yes. Suitable treatment can be selected in accordance with the resin and use.
Is it possible to change the particle size?
Yes. Please inquire for details.
Contact usIs it possible to change the thickness?
Firstly, please consider standard thickness products (1 µm or less) that realize excellent dimensional stability and strength characteristics.
What is the price and delivery time?
Please inquire for details.
Contact usMICROGLAS; Registered Trade Mark in Japan, USA, Europe, U.K., Singapore, Malaysia and China.
