Samples provided by NSG were evaluated and subsequently presented at the 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), held in Dallas, USA, in May 2025.

In this presentation, our product, the “Low-Dielectric Glass Flake,” was utilized and introduced under the following title:
• Presentation Title: Low Dk/Df Siloxane Hybrid Laminates for Advanced Packaging Substrate
• Affiliation: Korea Advanced Institute of Science and Technology (KAIST)
The abstract of this presentation is available at the following link:

[Presentation Abstract(KAIST Website)]

We are honored that our product has been highlighted in academic research, and we will continue to strive to contribute to the advancement of both research and industry.